Multichip module structure
US6833626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Nov 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B12/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A large chip includes a first set of branch wires that branch off from a first trunk wire and extend to respective wires so as to be connected to respective bond pads. Each of the branch wires of the first set includes a connection control element and a resistor. A small chip includes a second set of branch wires that branch off from a second trunk wire and extend to respective wires so as to be connected to respective bond pads. Each of the branch wires of the second set includes a connection control element and a resistor. Whether connection is properly made or not between the bond pads is determined by measuring a current value when voltage is applied to first and second test pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.