MEMS enclosure
US6833944B2 · kind B2 · utility
3Cited by
4References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 23, 2004 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Jan 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.