Combination terminal/leadframe for heat sinking and electrical contacts
US6833997B1 · kind B1 · utility
16Cited by
5References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2003 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | Jun 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10924
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuitboard assembly in which power carrying circuitboard traces between MOSFETs or the like and edge terminals are replaced with metal leadframe structures which also serve to perform a heat dissipation function. Each of the leadframes comprises a first planar portion which is bonded by a thermally conductive epoxy to the top surface of a MOSFET and a second elevated planar portion which extends parallel to but above the circuitboard surface into contact with an edge-mounted terminal header. The leadframes may be provided with support legs as well as additional heat dissipating fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.