Solder-bearing components and method of retaining a solder mass therein
US6834791B2 · kind B2 · utility
6Cited by
18References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 13, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jan 13, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of retaining a solder mass within a solder-bearing component is provided and includes the steps of: (a) forming a plurality of fingers in the solder-bearing component at one edge thereof, with each finger being defined by a pair of slots formed in the solder-bearing component; and (b) interleaving a solder mass between the fingers such that the solder mass is securely held by the fingers. The solder-bearing component includes any number of different types of components where a solder mass is held thereby, e.g., leads, terminals, connectors, electromagnetic shields, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.