Printhead corrosion protection
US6834937B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Feb 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/361
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for encapsulating electrical traces on a flexible circuit or TAB circuit and electrical connections between the flexible circuit or TAB circuit and a printhead substrate to inhibit ink corrosion thereof. The method includes applying a first adhesive to a first surface of the flexible circuit or TAB circuit. A second adhesive is applied to first surface of the flexible circuit or TAB circuit whereby the first and second adhesives effectively coat exposed portions of the traces and connections. The first and second adhesives are thermally curable epoxy compositions that are miscible with each other and the first adhesive has a first viscosity and first thixotropy index that is lower than a second viscosity second thixotropy index of the second adhesive. After applying the adhesive, the first and second adhesives are cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.