Opto-electronic component packaging

US6835004B2 · kind B2 · utility

Assignee

• T-Networks, Inc. · US

Inventors

• Jason T. Iceman · Cheshire, US
• Walter Jeffery Shakespeare · Macungie, US
• John Kai Andersen · Emmaus, US

Key dates

• Filing date: Aug 26, 2002
• Grant date: Dec 28, 2004
• Expiry date: Apr 9, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4214
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An opto-electronic package is provided for mounting on a module base. The package comprises a generally rectangular package. An optical connector extends from a first side of the package body along an optical axis, generally parallel to the module base. A radio frequency connector extends from a second side of the package body along a RF axis, generally parallel to the module base. A plurality of electronic leads and mounting tabs each extend from at least one of the second side and a third side of the package body. A fourth side of the package body is adjacent the first side and free of connectors, leads, and mounting tabs for mounting the package in a corner of the module formed by first and second module walls. The fourth wall of the package body is positioned adjacent the first module wall and the optical connector extends through the second module wall.