Folded expand-on-site paper packaging
US6835437B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2000 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Nov 29, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2978
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A series of interconnected packing chip precursors that can be formed and transported economically to a packager as a flat sheet and then expanded at the site where they will be used into individual packing chips by folding and separation from the other chips. Preferably, the precursors are formed on a chipboard sheet by forming fold lines and lines of separation and by adding securing means, such as bonding media or connecting features to secure the sides of the expanded packing chip in its final shape. The fold lines and lines of separation can be configured to form jagged or serrated edges on the expand-on-site packing chip, and the chip may also include apertures; the jagged and serrated edges and the apertures cooperating with each other and other aspects of adjacent chips to interlock the chips when they are placed around an item in a package for shipment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.