Flexible printed wiring board
US6835442B2 · kind B2 · utility
10Cited by
1References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 12, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Sep 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.