Clean release, phase change thermal interface
US6835453B2 · kind B2 · utility
67Cited by
59References
72Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jun 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A laminar, thermally-conductive interface interposable intermediate a first heat transfer surface and an opposing second heat transfer surface to provide a thermally-conductive pathway therebetween. The interface includes a first layer formed of a flexible, lamellar graphite or tin foil material, and a second layer formed of a thermally-conductive phase-change material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.