Microchip-level optical interconnect
US6835582B1 · kind B1 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Aug 6, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3692
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of sealing an optical fiber in a microchip includes providing a device microchip, a top microchip and an optical fiber; forming a groove in at least one of the device microchip and the top microchip; coating metal on the optical fiber; depositing metal on the groove and top surfaces of the device microchip and the top microchip; depositing solder on the top surface of at least one of the device microchip and the top microchip; placing the optical fiber in the groove; placing the top microchip on the device microchip; and reflowing the solder to form a hermetic seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.