Patent · US Expired

Method for producing semiconductor laser components

US6835603B2 · kind B2 · utility

3Cited by

2References

29Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Bruno Acklin · Regensburg, DE
Stefan Grötsch · Regensburg, DE

Key dates

Filing date	Aug 20, 2001
Grant date	Dec 28, 2004
Priority date	—
Expiry date	Apr 22, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/4025
WIPO fieldOptics
WIPO sectorInstruments

Abstract

A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.