Stabilized thermoplastic molding materials
US6835776B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Jan 16, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding materials containing the following ingredients with regard to components A-F: A) 5-70 wt. % of at least one graft copolymer A) consisting of a rubber elastic base with a glass transition temperature below 0° and a grafted overlay made of a styrene compound and acrylonitrile or methacrylonitrile or mixture thereof in addition to, optionally, other monoethylenically unsaturated monomers, B) 29-90 wt. % of a hard copolymer made of at least one styrene compound, acrylonitrile or methacrylonitrile or mixtures thereof and, optionally, other monoethylenically unsaturated monomers, C) 0-5 wt. % of at least one three-block copolymer X-Y-X with a middle block Y propylenoxide units and terminal block X made of ethyleneoxide units, D) 0.01-5 wt. % of at least one butylated reaction product of cresol with dicyclopentadiene, E) 0.01-5 wt. % of at least one thiocarboxylic acid ester, F) 0.01-5 wt. % of at least one alkaline metal salt or alkaline earth metal salt of a C6-C20carboxylic acid, G) 0-30 wt. % in relation to constituents A)-G), of other usual additives. The moulding materials exhibit a db* -value, after exposure to the atmosphere, of less than +5,0 after 100 h…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.