Passive element component and substrate with built-in passive element
US6835889B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2002 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Sep 23, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a composite material such as a passive element, a passive element composite component, a substrate with a built-in passive element and a composite wiring substrate which are free from, for example, a layer peeling problem and enables high density packaging with ease. In the present invention, a porous base material is divided into plural functional regions and a material having different electromagnetic characteristics is filled in a pore of the porous base material of each functional region, to form a passive element or a wiring substrate. Among the aforementioned plural functional regions, at least one functional region is a conductive material region filled with a conductive material and other regions are filled with a high-dielectric material, a high-permeability material or a low-dielectric material. This structure ensures that a single passive element, plural passive elements or a wiring substrate provided with a circuit wiring can be formed on a porous base material efficiently.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.