Light emitting diode package structure
US6835960B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Mar 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.