Power semiconductor module

US6835994B2 · kind B2 · utility

Assignee

• EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE

Inventors

• Michael Kistner · Lockport, US
• Reinhold Dillig · Memmelsdorf, DE
• Sebastian Raith · Erlangen, DE
• Manfred Loddenkoetter · Ibbenbüren, DE
• Reinhold Bayerer · Warstein, DE

Key dates

• Filing date: Nov 18, 2002
• Grant date: Dec 28, 2004
• Expiry date: Nov 18, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module contains a power component and a sensor component. The power component is disposed on a first substrate. The sensor component is electrically and/or mechanically insulated from the power component by being disposed on an individual, separate second substrate. In this manner, disturbances of the sensor system section caused by the power section and its operation can be avoided particularly reliably.