High voltage flip-chip component package and method for forming the same
US6836022B2 · kind B2 · utility
6Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2003 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip-chip package comprises a substrate having at least one layer and a component flip-chip mounted to the substrate, the component having a field termination ring. The flip-chip package further comprises a shield plane interposed between the at least one layer of substrate and the field termination ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.