Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same
US6836138B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2004 |
| Grant date | Dec 28, 2004 |
| Priority date | — |
| Expiry date | Mar 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A ball grid array (BGA) package test module includes BGA packages, a module board, and test architecture for use in testing the BGA packages while they are mounted to the module board. The test architecture of the BGA package test module includes package test signal lines connected to solder balls of the BGA packages as extending along a bottom surface of the BGA packages, board test signal lines extending along the module board, and electrical junctions that interconnect the package and board test signal lines. Signals from the BGA packages can be picked up by the probe of a testing apparatus via the board test signal lines. The present invention is advantageous in that it minimizes the effect of stubbing by the test signal lines when the memory module is operating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.