Patent · US Expired

MEMS and MEMS components from silicon kerf

US6838047B2 · kind B2 · utility

2Cited by

7References

10Claims

0Family size

Inventors

Romain Billiet · Tualatin, US
Hanh Nguyen · Bukit Mertajam, MY

Key dates

Filing date	Aug 23, 2002
Grant date	Jan 4, 2005
Priority date	—
Expiry date	Dec 22, 2022

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C1/00333
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

The disclosure describes an economical and environmentally benign method for using crystalline silicon metal kerf recovered from wiresaw slurries towards the fabrication of complex MEMS and MEMS components, including MEMS packages, with improved design features.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.