Patent · US Expired

Platinum silicide permeation layer device with microlocaions

US6838053B2 · kind B2 · utility

14Cited by
73References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 3, 2001
Grant dateJan 4, 2005
Priority date
Expiry dateNov 14, 2021

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC40B40/10
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.