Platinum silicide permeation layer device with microlocaions
US6838053B2 · kind B2 · utility
14Cited by
73References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2001 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Nov 14, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC40B40/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.