Electrical circuit board and a method for making the same
US6838623B2 · kind B2 · utility
1Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jan 9, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.