Semiconductor device and manufacturing method thereof
US6838765B2 · kind B2 · utility
4Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention comprises a first main face (22a) on a surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered thereto. The semiconductor chip (29), etc. are sealed in the hollow portion that is constructed by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the transparent glass plate (36) are adhered by epoxy resin, or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.