Semiconductor device
US6838891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Nov 10, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05554
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device includes a plurality of semiconductor integrated circuits formed on a semiconductor wafer; an testing pad for inputting and outputting a signal to and from an internal circuit of the semiconductor integrated circuit; a switch for switching a state of a connection between the semiconductor integrated circuit and the testing pad; and a wiring pattern formed on a parting line around the semiconductor integrated circuit and connected to an input terminal of the switch. When the semiconductor integrated circuits are separated, cutting off of the wiring pattern causes the switch to be turned off, so that the internal circuit is prevented from being affected by the influence of the cutting plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.