High-frequency interconnection for circuits
US6838953B2 · kind B2 · utility
0Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2002 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Aug 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An RF microcircuit package and interconnection device is disclosed which minimizes impedance mismatch between circuit elements. Multiple signal via and close proximity ground vias as well as tuned wire bonds are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.