Fan-less housing
US6839232B2 · kind B2 · utility
8Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | May 3, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a heat dissipating internally fan-less housing (20) for electronic circuits and components (28), the housing has an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing, a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long-side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.