Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
US6839476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Apr 16, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3652
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.