Method and device for predicting temperature profiles throughout the thickness of a polymer preform
US6839652B2 · kind B2 · utility
5Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 28, 2003 |
| Grant date | Jan 4, 2005 |
| Priority date | — |
| Expiry date | Jul 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7158
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for determining the temperature distribution throughout the thickness of a preform used in a container reheat stretch blow molding process by measuring the outside surface temperature of a preform or series of preforms at least two times during the period the preform is cooling down after exiting the heat station and before entering the blow molding station in the blow molding machine and calculating the temperature distribution throughout the thickness of the preform based upon the measured outside surface temperatures using a novel algorithm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.