Method for producing a circuit unit
US6839963B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1999 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Dec 9, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A circuit unit having a circuit unit comprising an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layers (9, 17) separated by insulating layers (11). To inter-connect the individual coil layer section (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.