High performance heat exchange assembly
US6840307B2 · kind B2 · utility
13Cited by
32References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 13, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Mar 22, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.