Compact thermosiphon for dissipating heat generated by electronic components
US6840311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Mar 8, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.