Patent · US Expired

Injection-molded element

US6840821B2 · kind B2 · utility

1Cited by

8References

12Claims

0Family size

Assignee

Integrated Electronic Systems !SYS Consulting GmbH · DE

Inventors

Wolfgang Bredow · Mühlacker, DE
Thomas Burchard · Pforzheim, DE
Thomas Haug · Bern, CH

Key dates

Filing date	Apr 26, 2002
Grant date	Jan 11, 2005
Priority date	—
Expiry date	Feb 25, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01R2201/06
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

An injection molded element in combination with at least one electrical contact element embedded in the injection molded element. The injection molded element forms a wall element of an electric or electronic device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.