Package structure for mounting a field emitting device in an electron gun
US6840834B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Jan 19, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2201/304
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus and method are provided for a package structure that enables mounting of a field-emitting cathode into an electron gun. A non-conducting substrate has the cathode attached and the cathode is electrically connected to a pin through the substrate. Other pins are electrically connected to electrodes integral with the cathode. Three cathodes may be mounted on a die flag region to form an electron gun suitable for color CRTs. Accurate alignment of an emitter array to the apertures in the electron gun and other electrodes such as a focusing lens is achieved. The single package design may be used for many gun sizes. Assembly and attachment of the emitter array to the electron gun during construction of the gun can lower cost of construction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.