Wafer treatment method for protecting fuse box of semiconductor chip
US6841425B2 · kind B2 · utility
1Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2002 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Nov 9, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for treating a wafer to protect a fuse box of a semiconductor chip are provided. These methods include applying an insulating coating solution onto the surface of at least one of a plurality of fuse boxes in a semiconductor chip so as to prevent moisture or impurities from seeping into the fuse box. With these methods, the degradation of the semiconductor chip can be substantially reduced by protecting the fuse box from a high-temperature and very humid atmosphere, and impurities such as particles. Thus, characteristics and reliability of the semiconductor chip can be also improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.