Overlay control for laser peening
US6841755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Mar 6, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D2221/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of controlling the application of laser peening overlays on the surface of a workpiece to reduce the variability of shock waves generated therein, comprises applying an energy-absorbing overlay to a portion of the surface of a workpiece, measuring the thickness of the energy-absorbing overlay in at least one location on the energy-absorbing overlay, applying a transparent overlay material over the energy-absorbing overlay, measuring the thickness of the transparent overlay in at least one location on the transparent overlay, determining if the measured values for each overlay is within a specified range, and directing a pulse of coherent energy to the workpiece to create a shock wave therein when the measured values are within the specified range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.