Semiconductor device having grooves to relieve stress between external electrodes and conductive patterns
US6841853B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 12, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Feb 12, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device including a semiconductor chip having an electric circuit on a surface thereof, and an electrode pad formed on the surface of the semiconductor chip and which is electrically connected to the electric circuit. A conductive pattern is electrically connected to the pad, and a sealing resin covers the electric circuit and the conductive pattern. A part of the conductive pattern is exposed from the sealing resin, and a plurality of grooves are formed on the part of the conductive pattern. The plurality of grooves are disposed apart from each other and along a direction of stress of the expanding semiconductor chip. An external electrode is electrically connected to the conductive pattern. Stress of the external electrodes is thus relieved and as a result, reliability of the semiconductor device can be improved, because deterioration of the connecting quality can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.