Electronic package assembly

US6841869B1 · kind B1 · utility

Assignee

• Motorola, Inc. · US

Inventors

• Markos Triantafyllou · Munich, DE
• Will Specks · Munich, DE
• Claude Escoffre · Munich, DE

Key dates

• Filing date: Jun 21, 1999
• Grant date: Jan 11, 2005
• Expiry date: Jun 21, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K1/181
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic package assembly includes a number of semiconductor devices with first and second sides. A printed circuit substrate has a number of printed circuit patterns bonded to conductive pads of the first sides of the devices. A metal leadframe includes leads which provide external connections for the package assembly, and also includes a non-lead island portion bonded to conductive pads of the second sides of the devices. In this way the island portion of the leadframe forms an interconnection between the second sides of the devices.