High gain integrated antenna and devices therefrom
US6842144B2 · kind B2 · utility
13Cited by
19References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2003 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Jul 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q9/28
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An integrated circuit for wireless communications includes substrate, at least one integrated antenna formed in or on the substrate, and a heat sink. At least one dielectric propagating layer is disposed between the integrated antenna and the heat sink which provides a thermal conductivity of at least 35 W/m·K and resistivity greater than 100 Ohm-cm at 25 C. The invention can be used to establish an on-chip or inter-chip wireless link over at least a 2.2 cm distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.