Thermal compensation for head protrusion in a magnetic drive
US6842308B1 · kind B1 · utility
23Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2001 |
| Grant date | Jan 11, 2005 |
| Priority date | — |
| Expiry date | Nov 25, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3136
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A head for a magnetic drive that includes a substrate with a thermal expansion rate CTE1. A transducer in the head has a bond to the substrate and has a transducer thermal expansion rate CTE2 that is greater than CTE1. A restraint layer in the substrate has a bond to one side of the transducer and has a first restraint layer thermal expansion rate CTE3 that is lower than CTE1. The restraint layer restrains protrusion of the transducer beyond the substrate at higher operating temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.