Pseudo-coaxial wafer assembly for connector
US6843687B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2004 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Feb 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6599
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high-density connector utilizes a plurality of terminal assemblies that are assembled together into a block, or single unit, to form a connector. Each terminal assembly of the connector utilizes a plurality of conductive terminals having contact portions for mating with an opposing connector, tail portions for mounting to a circuit substrate and body portions held within an insulative body portion of the assembly. The body portions are supported within a housing in the form of a wafer which is plated with a conductive material so as to provide an all encompassing ground structure that surrounds the terminals and their insulative supporting terminal assemblies. In this manner a reference ground is provided around each signal terminal between its contact and tail portions that emulates a coaxial cable. The tails of the terminals and the ground structure have wide body portions with narrow contact portions to promote wicking of solder onto the tails for establishing a reliable solder mounting of the connector to a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.