Solders
US6843862B2 · kind B2 · utility
4Cited by
1References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 17, 2001 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Aug 17, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substantially lead-free solder with enhanced properties comprises from 88.5% to 93.5% tin; from 3.5% to 4.5% silver; from 2.0% to 6.0% indium; and from 0.3% to 1.0% copper. The solder may also comprise up to 0.5% of an anti-oxidant or anti-skinning additive. A solder embodying the invention finds particular utility in wave-soldering processes where it may be used as a direct replacement for conventional tin/lead solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.