Heat-conductive silicone rubber composition
US6844393B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2003 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-conductive silicone rubber composition is provided. This composition comprises (A) an organopolysiloxane with an average of at least 0.1 alkenyl groups bonded to silicon atoms within each molecule, (B) an organopolysiloxane with an average of at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a heat-conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane with a hydrolyzable group and a vinyl group, as represented by a general formula shown below. This composition displays superior molding workability and adhesion, even if a large quantity of a heat-conductive filler is added to the composition
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.