Protecting resin-encapsulated components
US6845004B2 · kind B2 · utility
26Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2003 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Mar 30, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/32245
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of protecting surface mount capacitors from moisture and oxygen corrosion by applying a thermally curable pre-coat resin to a portion of the terminals of a capacitor and encapsulating the capacitor element(s) with a protective resin. The pre-coat resin is substantially rigid at ambient temperatures and flexible at elevated temperatures and is preferably a lactone-containing epoxy resin. The pre-coat resin may be applied to a solder coating-free portion of the terminals by brush or wiper prior to encapsulating the capacitor element(s) with the protective resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.