High performance heat sink configurations for use in high density packaging applications
US6845010B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 14, 2003 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | May 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An enhanced heat dissipation device to extract heat from an integrated circuit device includes a thermally conductive core having upper and lower outer surface areas. The device further includes a first array of radially extending pin fin structures. The first array is thermally coupled to the upper surface area such that a cooling medium introduced around the core and the first array creates an omni-directional flow around the first array and the core to enhance heat dissipation from the integrated circuit device. The core including the first array and the lower surface area are of sufficient size to allow components on a motherboard to encroach onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.