Sensor chip with additional heating element, method for preventing a sensor chip from being soiled, and use of an additional heating element on a sensor chip

US6845660B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Hans Hecht · Stuttgart, DE
• Uwe Konzelmann · Asperg, DE
• Torsten Schulz · Pinneberg, DE

Key dates

• Filing date: Mar 13, 2002
• Grant date: Jan 25, 2005
• Expiry date: Mar 13, 2022

Classification

• Technology area (CPC G): Physics
• CPC primary: G01F1/699
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor chip exposed to a flowing medium is provided with an additional heater situated upstream and at a definite distance from the sensor area, resulting in the impurities in the flowing medium being deposited in the area of the additional heater, and in the impurities being unable to reach the sensor area.