Modular mounting arrangement and method for light emitting diodes
US6846093B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Jul 21, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. A heat conductive adhesive tape connects the LED module to the mount surface. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. A plurality of such LED modules can be pre-wired together in a substantially continuous fashion and provided in a dispenser, such as a roll or box. Thus, to install a plurality of such LED modules, a worker simply pulls modules from the dispenser as needed, secures the appropriate number of modules in place, and connects the assembled modules to a power source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.