Compound dip process for metal cans

US6846143B2 · kind B2 · utility

Assignee

• Ball Packaging Europe GmbH · DE

Inventors

• Reinhard Kutschan · Salzgitter, DE
• Hellmut Bunsch · Hamburg, DE

Key dates

• Filing date: Jan 30, 2003
• Grant date: Jan 25, 2005
• Expiry date: Jan 30, 2023

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B65D7/36
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Sealant is applied onto or into a folded-seam closure of a metal can. Instead of introducing sealant into the U-shaped lid flange and drying, the compound or sealant is applied to the flange base. The base of the metal can is dipped into a current of fluid sealant or at least brought into contact with it at the surface. This substantially improves the precision of dosing and the exact amount of applied sealant.