Adhesive film for underfill and semiconductor device using the same
US6846550B2 · kind B2 · utility
3Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Nov 12, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.