Hot-melt adhesives based on polyamide-block graft copolymers
US6846874B2 · kind B2 · utility
5Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Feb 26, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a hot-melt adhesive composition comprising:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.