Optical module ground strip
US6846986B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Nov 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/6582
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
RF emission may be reduced by providing grounding strips between optical transmitter and receiver modules in an optical transceiver package. The grounding strips includes an upper portion to fit over a top of the module, a transition portion to span a distance between the top of the module and the board, and a lower portion in electrical connection with a grounding pad on the board. The grounding strip may be substantially as wide as the module that it covers. Angled tabs may be provided to fit within registration holes in the ground pad. The grounding strip may be press-fitted onto the module or soldered. The low impedance ground strip increases the connectivity of the optical module to the board and may replace grounding leads to the external housing to reduce RF emissions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.