Power electronics component
US6846987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2002 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Aug 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) arm connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.