Microelectrode machining device
US6847002B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2004 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | Mar 8, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H7/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The microelectrode machining device disclosed by the invention mainly comprises a platform, a wire supply mechanism, a wire guide, and two (electric conductor)elements, wherein the platform can be fixed at an EDM machine and the wire supply mechanism is arranged on the platform for providing the wire needed in the EDM process, and the wire guide disposed on the platform has an arch-slide arranged thereon and a groove arranged at a position corresponding to the middle of the arch-slide on the wire guide, in addition, the two (electric conductor)elements are arranged on the platform to supply the power needed in the EDM process, and the two (electric conductor)elements are disposed respectively at the side of wire guide, and the altitudes of the bottom of both the wheel-shaped (electric conductor)element are lower than that of the wire exit and wire entrance of the arch-slide of the wire guide, in respective. By the design of aforementioned structure, the wire supplied by the wire supply mechanism first passes through the bottom of the (electric conductor)element, and enters the arch-slide from the wire entrance and exits the same from the wire exit, and passes again through the bott…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.